IPCO to Highlight Chocolate Forming Tech at Interpack

IPCO will highlight its high-performance chocolate forming technologies at Interpack 2026, with live demonstrations of its flagship Rotoform HP rotary drop depositor.

The system, positioned at the core of IPCO’s chocolate moulding portfolio, is designed to deliver high-capacity production of chips, chunks and drops with consistent shape and size. According to Mitchell Paquaij, Global Segment Manager for Chocolate, the Rotoform platform remains central to the company’s forming solutions, with Interpack visitors invited to see the latest model in operation.

The Rotoform HP integrates a heated stator and perforated rotating shell to deposit liquid chocolate onto a continuously moving steel belt. Synchronised deposition and rapid cooling ensure minimal deformation and limited oxygen exposure, supporting product quality and shelf stability. The system also allows flexible output, with chip sizes ranging from 80,000 to 300 pieces per kilogram through interchangeable components.

Alongside forming technology, IPCO will present its triple-pass chocolate cooling systems, designed to maximise throughput while minimising footprint. These systems enable multi-stage cooling on a single line and can be configured for a range of products, including chips, chunks and wafers.

The company will also showcase a recently introduced piston depositor, developed for precision forming of larger wafer formats. The system can be integrated with Rotoform and extrusion equipment on chip and chunk moulding lines, allowing multiple depositing technologies to operate on a single production line.

IPCO’s broader offering at the show will include its steel belt solutions, which underpin continuous cooling and solidification processes across confectionery applications such as chocolate, caramel, nougat and brittle. The company’s technology portfolio targets end-to-end process optimisation, from depositing through to cooling and handling.